Supplying technologies that support vehicle makers across the powertrain evolution, Marelli will showcase its latest e-Transmission Cooling Pump, a system engineered to deliver precise, on-demand oil cooling for modern transmissions. The solution maximizes efficiency, enabling a 30-watt saving compared with the main market benchmark.

With solutions for different propulsion configurations and regional requirements, Marelli will highlight a selection of innovations among the solutions at its booth at Auto China 2026.

The company’s latest e-Transmission Cooling Pump technology is based on a modular solution for transmission control, designed and optimized specifically for e-axles and dedicated hybrid transmissions (DHT), which offers high efficiency (40%), seamless integration and a competitive cost. Leveraging a flexible design which uses brushless technology and integrated electronics, the same base module can also support other multiple applications at the transmission level.

Among its main features, the technology delivers operational efficiency, minimizes energy consumption and improves both electric and fuel economy. Designed for compatibility with mechanical and electronic environments, the solution reduces integration and validation costs. Available in both 12-volt and 48-volt variants, it is the first application of Marelli’s modular smart actuator concept that will address a wide range of automotive applications, ensuring compatibility with current vehicle architectures and emerging multivoltage platforms.

Marelli will also showcase its flex fuel system, which addresses the demand for sustainable, high-performance 3- and 4-cylinder engines by enabling the use of biofuels and ethanol. Automatic fuel detection optimizes fuel efficiency and emission performance, while integrated fuel rail heaters ensure reliable cold starts. The system delivers enhanced flexibility, reduced environmental impact and design and manufacturing tailored to regional market requirements.

Thermal management

In addition to propulsion solutions, Marelli will also present innovations from its Green Technologies division, which focuses on optimizing vehicle thermal energy and exhaust gas management.

Merelli will highlight a selection of technologies designed to maximize thermal efficiency for hybrid and electric powertrains, including the High-Performance Chiller, which enhances battery thermal management in electrified vehicles. Compared with previous designs, the solution delivers higher heat exchange performance, improving battery temperature control and energy efficiency. These gains are achieved through an ultra-fine inner fin structure and a lightweight design, which allow compact dimensions and more uniform refrigerant flow. The system supports high charging rates, while offering strong cost advantages.

The eAxle Oil Cooler is a lightweight and efficient solution for effective heat exchange. It features a new inner fin design that enables compact size and improved thermal performance, combined with an optimized dimple structure that increases water flow speed and reduces dead water areas, boosting cooling efficiency. The miniaturized design delivers space and weight savings, offers flexibility to accommodate different layouts and provides cost advantages while meeting stringent performance standards.

Finally, the company will feature the Full Aluminum Radiator, a solution for electric powertrains. The low-temperature radiator is designed to support efficient and reliable battery cooling for new energy vehicles. The solution enables high heat transfer performance and flexible layout, offering reduced costs and faster cooling.

Auto China 2026 will take place in Beijing from April 24 to May 3.

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Ideal Semiconductor has launched its SuperQ MOSFET technology, purpose-built to solve the critical safety and efficiency trade-off in high-voltage (72V and higher) battery management systems (BMS).

The growing adoption of high-voltage battery packs in e-mobility presents a challenge: managing the risk of failure during external short-circuit events, where currents can reach thousands of amps. The discharge MOSFET – metal-oxide-semiconductor field-effect transistor – is the component responsible for safely isolating the battery pack under such conditions.

“In high-energy packs, robustness is non-negotiable,” said Dr Phil Rutter, VP of design at Ideal Semiconductor. “Traditional MOSFET designs are forced to compromise between achieving ultra-low RDS(on) for efficiency and the structural integrity needed to survive a massive short-circuit current. The SuperQ platform eliminates this compromise. Our proprietary cell structure delivers the market’s lowest on-resistance alongside a safety margin that is simply unmatched, giving designers the confidence to build smaller, more reliable and lower-cost battery systems.”

The SuperQ solution features a proprietary cell structure with a wider conduction region that maximizes power density and structural integrity under extreme stress. Following internal testing, the SuperQ’s iS15M2R5S1T (150V, 2.5mΩ, TOLL package) went head-to-head against a leading competitor. The test revealed the SuperQ device exhibited 1.4 times higher short-circuit failure capability than its closest competitor.

In related news, Infineon and Munich Electrification partner to advance high-voltage battery management systems

ZF has presented an enhanced 8HP evo automatic transmission in response to the global boom in hybrid drives. Based on the benchmark 8-speed transmission and equipped with further developments, the 8HP evo is designed for a wide range of hybrid platforms.

“Manufacturers today need fast, flexible and scalable solutions for a broad drive portfolio. The 8HP evo delivers exactly that and covers the full range. This combination is currently unique,” said Mathias Miedreich, a member of ZF’s executive board and responsible for the electrified drive technology division. “Hybridization is not an interim solution, but part of the answer. The 8HP evo combines range, efficiency and flexibility. Our technology suits the diversity of the markets.”

One transmission

The 8-speed automatic transmission’s current generation was designed for use in hybrid models in addition to conventional combustion drives, in accordance with the modular principle. In the further development of the current 8HP evo, ZF chose to focus on electrification and efficiency; the latest version uses fewer components than its direct predecessor.

All components were considered in their role in achieving a greater electric range. ZF further developed the electric motor, the power electronics and the mechanical components, as well as the higher processor performance to advance software functions. The software structure has been changed so that manufacturers can now dock onto the transmission control software more easily.

Benchmark transmission benefits

The 8HP evo also benefits from the ZF Select platform, a modular and scalable solution for electrified drivetrains. “This experience has been directly incorporated into the further development of our established benchmark product,” summarized Dr Otmar Scharrer, head of development for electrified drive technologies. “In this way, we are ensuring that we can also fully exploit the possibilities of electrification in hybrid drives.”

In the plug-in hybrid (PHEV) configuration, for example, the maximum electrical output increases from 160kW to 200kW and the maximum electrical torque from 500Nm to 600Nm. Losses at the input shaft are reduced by around 28%. Together with further functional development, this means that up to 10% more range is possible with the same battery capacity compared with the predecessor model. This is achieved while at the same time reducing the use of heavy rare earths, which in turn makes an important contribution to cost-efficiency and sustainability. “The 8HP evo hybrid transmission has a modular design and therefore cost-effectively meets a wide range of requirements – for both mid-range and luxury vehicles,” said Scharrer.

The electrified 8-speed automatic transmissions have been designed for use in 48V mild hybrids (MHEV) and 400V PHEV systems. With the 8HP evo, ZF offers a dedicated solution for vehicles without external charging options – HEV platforms on a 400V basis. With this approach, the batteries are charged while driving, for example through recuperation, and the entire transmission is lighter than the PHEV variant.

In related news, Mercedes-AMG has introduced the GT2 Edition W16 – its most powerful customer racing car

Rimac Technology has unveiled its latest portfolio of advanced battery and powertrain technologies, including next-generation solid-state solutions and evolutions of its current batteries and e-axles.

Batteries

Working in collaboration with ProLogium and Mitsubishi Chemical Group, Rimac has developed an advanced battery system featuring solid-state cell technology and innovative housing solutions. ProLogium’s solid-state cells are integrated with Mitsubishi Chemical Group’s advanced materials expertise to create a battery platform that is lighter, safer and more energy dense.

Based on 46XX Gen2 NMC cells and next-generation thermoplastic composite battery housing (Pentatonic) co-developed with Kautex Textron, Rimac’s Evo Technology is an alternative platform that combines cell chemistry with packaging and thermal management solutions.

Branching into hybrid solutions, Rimac has designed a hybrid platform to address two key market demands: high-energy hybrid battery packs based on the 46XX cell format and power-dense hybrid packs based on the 2170 cell format. It offers scalability and interchangeable cell configurations, integrated in cell-to-pack architecture with advanced safety and thermal management features.

Powertrains

The SINTEG 300 and 550, single EM ultra-compact, fully integrated e-axles offer performance with power density exceeding 8kW/kg and torque density surpassing 90Nm/kg. The powertrain features a patented ultra-light rotor able to spin up to 25,000rpm and a novel magnet design. Based on Rimac’s scalable powertrain platform, the CoAxial or Offset configurable variants offer 150-360kW and 2,500- 6,250Nm to target performance-focused vehicles across all segments, from hot hatches and sports coupes to sedans and SUVs.

Rimac has also announced that the High Torque XXL Axle version of the Dual EM EDU 550 e-axle will enter series production in 2026 for a global OEM. The current validated system has proven >95% peak efficiency and delivers over 11,000Nm of axle torque.

Electronics and controls

Rimac Technology has also added to its portfolio of domain and zonal ECUs, powered by NXP’s S32E2 real-time processors. By consolidating multiple traditional ECUs into single high-performance domain controllers, Rimac offers a centralized architecture. These next-generation ECUs manage critical functions ranging from torque vectoring and high-voltage battery systems to body and power distribution controls, while assisting software-defined vehicle (SDV) adoption and over-the-air (OTA) updates.

These technologies were unveiled at IAA Mobility and will be produced at Rimac’s facilities in Croatia. “What we’re showcasing at IAA represents the convergence of breakthrough innovation and production readiness,” said Nurdin Pitarević, COO of Rimac Technology. “These aren’t simply concept technologies; they’ve been developed to be production-ready solutions that will power hundreds of thousands of vehicles in the coming years.”

In related news, UK’s Faraday Institution has pledged £9m for advanced battery research and commercial scale-up

Toshiba Electronic Devices & Storage (Toshiba) has launched the TLX9161T automotive photorelay in a small SO12L-T package. The photorelay achieves an output withstand voltage of 1,500V (min), the level required to support high-voltage automotive batteries.

Key challenges in popularizing electric vehicles include reducing charging times and improving cruising range. Addressing these challenges requires efficient operation of the battery system. This is done by using a battery management system, which monitors the battery’s charge status to enable high-efficiency system operation and monitors isolation between the battery and the vehicle body to ensure the safe use of high-voltage batteries. Electrically isolated photorelays are used in battery management systems that handle high voltages.

Toshiba’s latest high-voltage photorelay is a miniaturized version of the company’s TLX9160T. Miniaturizing the TLX9160T’s built-in MOSFET chip has enabled integration into the SO12L-T package, which has a mounting area that is approximately 25% smaller than the TLX9160T’s SO16L-T package. The pin pitch and pin layout are the same as those of the SO16L-T, enabling the use of the same circuit board pattern design.

The latest photorelay uses a resin with a comparative tracking index (CTI) exceeding 600, which is classified under Material Group I of the IEC 60664-1 international standard. The pin configuration ensures a creepage distance of more than 5mm on the detector side. This complies with IEC 60664-1, supporting an operating voltage of 1,000V.

In related news, Siemens Digital Industries Software has announced that Nidec Corporation, has adopted Teamcenter X software from the Siemens Xcelerator portfolio of industry software, with the goal of achieving innovative motor development and supply, and setting new industry standards, including automotive

XPeng and Volkswagen have signed an agreement to expand their technical collaboration by progressing the joint development of electrical/electronic (E/E) architecture.

With the goal of broadening the application of E/E architecture across the Volkswagen Group and enabling cross-platform and cross-powertrain scalability, the agreement includes plans to integrate the E/E Architecture into VW’s electric vehicle platforms, internal combustion engine (ICE) and plug-in hybrid electric vehicle (PHEV) platforms in China.

“The Expanded Technical Collaboration marks a significant milestone in the ongoing strategic collaboration between XPeng and the Volkswagen Group, following the signing of the Master Agreement on E/E Architecture Technical Collaboration on July 22, 2024,” said Xiaopeng He, chairman and CEO of XPeng. “This Expanded Technical Collaboration not only underscores the mutual trust in our long-term strategic partnership, but also highlights our commitment to and vision for continuous innovation in smart electric vehicle technologies.”

Ralf Brandstätter, CEO of Volkswagen Group China and member of the board of management of Volkswagen AG for China, added, “We do not confine technological excellence to a single powertrain type. Our brands are committed to delivering the most advanced solutions for customers in every segment. By extending the China Electronic Architecture to our robust combustion engine fleet, we are strengthening our technological leadership in the conventional powertrain sector.

“At the same time,” he continued, “we are systematically reducing our cost base, enabling us to continue offering highly attractive choices to customers in China’s intensely competitive automotive market. This will reinforce the company’s economic resilience, create capacity for targeted investment in cutting-edge innovations, and advance our journey toward fully connected, intelligent electric mobility.”

Related news: Read about the collaboration between Metier Technologies and Mahle Powertrain, and their demonstration of a hydrogen-powered commercial vehicle at CENEX Expo 2025 in the first week of September

Infineon Technologies has collaborated with Typhoon HIL to provide automotive engineering teams with a fully integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infineon’s Aurix TC3x/TC4x automotive microcontrollers (MCUs) now have a complete HIL simulation and test solution using Typhoon’s HIL simulator for ultra-high-fidelity motor drive, onboard charger, BMS and power electronics emulation, which provides a plug-and-play interface via the Infineon TriBoard Interface Card.

“Developers of xEV components, including motor drives, battery management systems, onboard chargers and DC-DC converters, increasingly rely on controller hardware-in-the-loop (C-HIL), on top of software-in-the-loop (SIL) and simulation-based approaches, to quickly achieve results and more rapidly iterate in both prototyping and test cycles,” said Christopher Thibeault, director of partnership and ecosystem management automotive Americas, Infineon Technologies. “With Typhoon’s proven real-time HIL platform, our Aurix customers can access a design and test environment that will help bring their automotive solutions based on dependable electronics to market faster.”

The solution includes Typhoon HIL simulators for real-time digital testing, a suite of testbed hardware and software tools and the Infineon TriBoard Interface Card, which supports Infineon Aurix TC3xx and TC4xx evaluation boards and plugs directly into a single row of DIN41612 connectors on the front panel of the HIL simulator. The solution aims to streamline validation workflows, expedites design and testing processes and reduces development costs and complexity for customers. Typhoon HIL also offers an Automotive Communication Extender product for its HIL simulator solution based on an Aurix TC3xx processor, which will provide an enhanced communication interface that allows customers to connect to a larger number of heterogeneous ECUs under test via CAN, CAN FD, LIN and SPI protocols.

“We are excited to partner with a leader in the automotive integrated circuits market, to provide MCU developers with a platform for development and testing of Aurix-based controllers before hardware design is completed,” said Petar Gartner, director of HIL solutions at Typhoon HIL. “Our joint customers gain a competitive edge by accelerating their design and test operations while reducing costs, which ultimately translates to market advantage. We look forward to this ongoing collaboration with Infineon.”

In related news, dSPACE has updated its MicroLabBox II – a compact development and test system used for controller hardware-in-the-loop (C-HIL) tests

Cleantech company QPT has filed a new patent for attaching dies to heat spreaders or substrates. The assembly process improves heat conductivity and increases reliability as less stress is placed on the substrates – one of the biggest challenges of the semiconductor packaging industry.

QPT developed the new qAttach process for use with the gallium nitride (GaN) transistors it uses in electric motor control designs to enable them to handle the huge amounts of waste heat. GaN transistors are rated for high voltages, but the die size is relatively small for high-voltage transistors. This means there is less surface area from which to remove heat. As a result, they are often downrated to enable them to function without overheating.

qAttach solves this problem as more heat can be removed from the die, preventing it from overheating. This enables GaN to be efficiently used for next-generation, high-power, high-voltage applications in automotive and industrial motors.

Rob Gwynne, QPT’s CTO, said, “We use reliable, well-established technologies from other fields in a novel way to enable us to create the qAttach attachment layer that is potentially down to a fraction of a micron thick. This major reduction in the thermal barrier thickness means that our solution is up to ten times better at transferring waste heat away from the chip. As we refine the process, we are expecting even better thermal transmission rates through this layer.”

QPT claims the qAttach layer is ultrathin, allowing heat to be transferred through and away much quicker to increase the rate of heat removal by up to 15x. The technology has other improvements over the current sintering process. First, the substrate can be thinner, thereby reducing thermal resistance to further assist heat transfer to the heat sink.

Second, the lower pressure required for this process reduces the manufacturing stresses on the dies. This in turn reduces the possibility of device failure – critical for automotive companies where reliability is important.

Last, the ultrathin qAttach layer is not a laminar sheet. Laminar sheets can result in the structure ripping itself apart when heated. This delamination is the largest cause of failures in power packages and QPT says the new approach improves the reliability of the assembled device.

Applied EV’s CEO, Julian Broadbent, said, “Both Applied EV and Cissoid recognize functional safety is critical in the development and deployment of autonomous vehicles. The partnership integrates Cissoid’s ICMs into our Digital Backbone, allowing for a faster development cycle, giving our customer the safest vehicle in the shortest time possible.”

Cissoid’s CEO, Dave Hutton, added, “We are excited to embark on this collaborative journey with Applied EV to drive innovation in e-mobility. By combining our expertise in electric motor design with Applied EV’s proficiency in software and vehicle integration, the aim is to deliver a game-changing electric motor drive platform for the future of mobility together.”

NXP Semiconductors has announced a collaboration with ZF on next-generation SiC-based traction inverter solutions for EVs. By leveraging NXP’s advanced GD316x high-voltage isolated gate drivers, the solutions are designed to accelerate the adoption of 800V and SiC power devices.

800V capabilites

“We look forward to working with NXP to raise the bar for the capabilities and performance of our 800V traction inverter solutions, which will help us achieve our goals of reducing emissions and promoting sustainability,” said Dr Carsten Götte, SVP electrified powertrain technology at ZF. “The combination of ZF’s expertise in motor control and power electronics with NXP’s GD316x gate driver family enables us to provide our latest SiC-based traction inverters with higher power and volume density, efficiency and differentiation, and provide our customers with significant safety, efficiency, range and performance improvements.”

Reduced EMC and switching times

NXP states that its GD316x family of advanced, functionally safe, isolated, high-voltage gate drivers incorporates a number of programmable control, diagnostic, monitoring and protection features to drive the latest SiC power modules for automotive traction inverter applications. Its high level of integration enables a smaller footprint and simplifies the system design. These capabilities are stated to reduce EMC noise while also reducing switching energy losses for greater efficiency. Fast short-circuit protection times (<1 µsec) in combination with powerful and programmable gate drive schemes optimize the performance of the traction inverter’s SiC power modules.

“Together with ZF, we are developing next-generation power electronics for future EVs,” said Robert Li, SVP and general manager, electrification at NXP. “Our gate driver family implements a number of outstanding features to both protect and unleash the benefits of high-voltage SiC power switches, making them an ideal choice for ZF’s new SiC-based traction inverter solutions. This collaboration is a testament to our commitment to delivering state-of-the-art solutions that enable OEMs to achieve their EV performance and sustainability goals.”

ZF traction inverters, enabled by NXP’s GD316x product family, are already on the road.