Advanced Conversion has selected Peak Nano’s NanoPlex LDF film for its new HP Drive Test Kit DC-link capacitors, designed for…
Browsing: Electronics
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat…
Polar Semiconductor and Nexperia have announced a strategic collaboration to manufacture next-generation power MOSFET devices at Polar’s US-based wafer foundry.…
Supplying technologies that support vehicle makers across the powertrain evolution, Marelli will showcase its latest e-Transmission Cooling Pump, a system…
Ideal Semiconductor has launched its SuperQ MOSFET technology, purpose-built to solve the critical safety and efficiency trade-off in high-voltage (72V…
ZF has presented an enhanced 8HP evo automatic transmission in response to the global boom in hybrid drives. Based on…
Rimac Technology has unveiled its latest portfolio of advanced battery and powertrain technologies, including next-generation solid-state solutions and evolutions of…
Toshiba Electronic Devices & Storage (Toshiba) has launched the TLX9161T automotive photorelay in a small SO12L-T package. The photorelay achieves…
XPeng and Volkswagen have signed an agreement to expand their technical collaboration by progressing the joint development of electrical/electronic (E/E)…
Infineon Technologies has collaborated with Typhoon HIL to provide automotive engineering teams with a fully integrated, real-time development and test…